Introduction to the principle of coating technology
1. Vacuum coating technology is an emerging technology. It was not until the 1960s that CVD (Chemical Vapor Coating) technology was applied to cemented carbide tools. Because this method needs to be carried out at high temperature (process temperature higher than 1000ºC), and the coating type is single, which has great limitations, it needs to be improved in the early stage of development.
2. The basic principle of ion plating: Under vacuum conditions, a certain plasma ionization technology is used to partially ionize the plating atoms, and at the same time generate a large number of high-energy neutral atoms, and apply a negative bias on the surface of the plating. Therefore, under the action of deep negative bias, ions are deposited on the surface of the substrate to form a thin film.
3, PVD is a physical vapor deposition method, which is divided into: vacuum evaporation method, vacuum sputtering method and vacuum ion method. PVD coating usually refers to vacuum ion coating; NCVM coating usually refers to vacuum evaporation coating and vacuum sputtering coating.
4. The basic principle of vacuum plating: Under vacuum conditions, metals, metal alloys, etc. are evaporated and then deposited on the surface of the substrate. The evaporation method usually uses resistance heating, electron beam bombarding the plating material to evaporate into the gas phase, and then deposit to On the surface of the substrate, the PVD method is the first in the history of vacuum evaporation technology.
5. The basic principle of sputtering coating: In a vacuum environment filled with argon (Ar) gas, when argon (Ar) atoms are ionized to form argon ions (Ar), the argon ions will accelerate the bombardment plating under the action of electric field force. The cathode target made of material, the target will be sputtered out and deposited on the surface of the workpiece. The incident ions in the sputtering film are generally obtained by glow discharge and are in the range of 10-2Pa~10Pa. Therefore, when the sputtered particles fly to the substrate, they will easily collide with the gas molecules in the air to make them move. The direction is random, and the deposited film is easy to be uniform.
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